Website review: IBM Extends Moores Law to the Third...
starspirit discovered this in Science/Tech
•11 reviews since Apr 12, 2007
science
•physorg.com/news95575580.html
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starspirit discovered 15 months ago- IBM today announced a breakthrough chip-stacking technology in a manufacturing environment that paves the way for three-dimensional chips that will extend Moore's Law beyond its expected limits. The technology - called "through-silicon vias" -- allows different chip components to be packaged much closer together for faster, smaller, and lower-power systems.
- hellisme rated 15 months ago
- IBM Extends Moore's Law to the Third Dimension Discussion at PhysOrgForum An IBM scientist holds a thinned wafer of silicon computer circuits which is ready for bonding to another circuit wafer where IBMacutes advanced quotthrough-silicon viaquot process will connect the wafers together by etching thousands of holes throug ... An IBM scientist holds a thinned wafer of silicon computer circuits, which is ready for bonding to another circuit wafer, where IBM's advanced "through-silicon via" process will connect the wafers together by etching thousands of holes through each layer and filling them with metal to create 3-D integrated stacked chips. The IBM breakthrough can shorten wire lengths inside chips up to 1000 times and allow for hundreds more pathways for data to flow among different functions on a chip. This technique will extend Moore's Law beyond its expected limits, paving the way for a new breed of smaller, faster and lower power chips.
- chaoscauser214 rated 15 months ago
- all this talk about chips makes me hungry.
- sension rated 15 months ago
- I'm a huge fan of anything that reduces power consumption and improves battery life. I love my mobile world.
- I'm a huge fan of anything that reduces power consumption and improves battery life. I love my mobile world.
- hobophobe rated 15 months ago
- Excellent. Three dimensional processors will not only continue Moore's Law, but will allow a more efficient (both in terms of energy use and processing) integration of CPUs and GPUs (and other special-purpose processing).
- schmeanel rated 15 months ago
- excellent - I'm waiting
- flyingrose rated 15 months ago
- From the page: "This is the fifth major chip breakthrough in five months from IBM, as it leads the industry in its quest for new materials and architectures to extend Moore's Law. "
- just-me rated 15 months ago
- From the page: IBM today announced a breakthrough chip-stacking technology in a manufacturing environment that paves the way for three-dimensional chips that will extend Moore's Law beyond its expected limits. The technology - called "through-silicon vias" -- allows different chip components to be packaged much closer together for faster, smaller, and lower-power systems.
- Trog rated 15 months ago
- Yum
